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功率器件封装用Cu-Sn全IMC接头制备及其可靠性研究进展
胡虎安, 贾强, 王乙舒, 籍晓亮, 邹贵生, 郭福
功率器件封装用Cu-Sn全IMC接头制备及其可靠性研究进展
Research Progress in Preparation and Reliability of Cu-Sn Full IMC Joints for Power Device Packaging
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