SiC功率模块引线键合参数优化与可靠性分析
李乐洲, 兰欣, 何志伟, 程勇
Optimization of Wire Bonding Parameters and Reliability Analysis for SiC Power Module Interconnections
LI Lezhou, LAN Xin, HE Zhiwei, CHENG Yong
电源学报
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2024, (3): 190
-198
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DOI: 10.13234/j.issn.2095-2805.2024.3.190