Junction Temperature Monitoring Method for Three-phase Inverter Power Device Based on Thermal Impedance Model

Junction Temperature Monitoring Method for Three-phase Inverter Power Device Based on Thermal Impedance Model

ZHANG Sihui, ZHAO Rui, YAN Shuai, XU Qiang and SONG Wensheng

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Journal of Power Supply ›› 2021, Vol. 19 ›› Issue (4) : 27-34. DOI: 10.13234/j.issn.2095-2805.2021.4.27

SiC， GaN Device, New Power Device and Its Applications

Junction Temperature Monitoring Method for Three-phase Inverter Power Device Based on Thermal Impedance Model

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2021, 19(4): 27-34 https://doi.org/10.13234/j.issn.2095-2805.2021.4.27

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