Optimization of Wire Bonding Parameters and Reliability Analysis for SiC Power Module Interconnections

Optimization of Wire Bonding Parameters and Reliability Analysis for SiC Power Module Interconnections

LI Lezhou, LAN Xin, HE Zhiwei, CHENG Yong

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Journal of Power Supply ›› 2024, Vol. 22 ›› Issue (3) : 190-198. DOI: 10.13234/j.issn.2095-2805.2024.3.190

Reliability Analysis

Optimization of Wire Bonding Parameters and Reliability Analysis for SiC Power Module Interconnections

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2024, 22(3): 190-198 https://doi.org/10.13234/j.issn.2095-2805.2024.3.190

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