Research Progress in Preparation and Reliability of Cu-Sn Full IMC Joints for Power Device Packaging

HU Hu’an, JIA Qiang, WANG Yishu, JI Xiaoliang, ZOU Guisheng, GUO Fu

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Journal of Power Supply ›› 2024, Vol. 22 ›› Issue (3) : 62-71. DOI: 10.13234/j.issn.2095-2805.2024.3.62
Packaging Design and Optimization

Research Progress in Preparation and Reliability of Cu-Sn Full IMC Joints for Power Device Packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2024, 22(3): 62-71 https://doi.org/10.13234/j.issn.2095-2805.2024.3.62

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