Design and Development of 1 200 A IGBT Power Module with EconoDUAL Packaging and 800 V Bus Voltage

HUI Xiaoshuang, NING Puqi, FAN Tao, GUO Xinhua, FU Jinyuan, HUANG Ke

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Journal of Power Supply ›› 2024, Vol. 22 ›› Issue (3) : 72-77. DOI: 10.13234/j.issn.2095-2805.2024.3.72
Packaging Design and Optimization

Design and Development of 1 200 A IGBT Power Module with EconoDUAL Packaging and 800 V Bus Voltage

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2024, 22(3): 72-77 https://doi.org/10.13234/j.issn.2095-2805.2024.3.72

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